2026-04-17
Kyson Tech to Showcase Biodegradable Packaging at Canton Fair 2026


5G Smart Factory Solutions Redefine Sustainable Innovation

Guangzhou, China – Kyson Tech (Hunan Kyson Tech Co., Ltd.) will unveil its latest biodegradable packaging solutions at the 139th Canton Fair, held from April 23 to 27, 2026 at the China Import and Export Fair Complex in Guangzhou. The company’s exhibit, located at Booth 15.2G 14/15/16, features advanced paper-based food packaging developed with 5G smart factory technology, reinforcing its position as a leader in sustainable manufacturing.

With an annual capacity of over 1.5 billion units, Kyson Tech’s portfolio includes eco-friendly paper cups, bowls, and containers designed for global F&B and retail markets. “Canton Fair is a launchpad for sustainable innovation,” a company spokesperson noted. “We’re excited to connect with forward-thinking partners to reduce environmental impact.”

Event Highlights:

  • Dates: April 23–27, 2026

  • Venue: China Import and Export Fair Complex, Pazhou, Guangzhou

  • Booth: 15.2G 14/15/16

  • Focus: Biodegradable paper packaging | 5G smart manufacturing

As sustainability reshapes global supply chains, Kyson Tech invites industry partners to explore next-generation packaging solutions. Visit Booth 15.2G 14/15/16 to collaborate for a greener future.